The SIT-200 uses a high-speed swept tunable laser, as opposed to a broadband source, to probe the wafer under test. This enables higher-power measurement per wavelength, leading to high dynamic range. As a result, thickness measurements can be performed even on un-polished wafers, for example during/after wet-etching.

• All-Optical, non-contact thickness sensor for silicon wafers
• High dynamic range capable of measuring disordered surfaces
• Capable of in-situ measurement during wet-etching